We are excited to announce that YITAI Precision Machinery will be exhibiting at WEPACK & SINO FOLDING CARTON 2026, the premier international exhibition for the packaging and folding carton industry. This highly anticipated event brings together industry leaders, innovators, and professionals from around the globe to explore the latest trends and technologies.
Event Details:
- Date: April 15–17, 2026
- Venue: International Convention and Exhibition Center
- Address: No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen
- Booth Number: 4A100
What to Expect at Our Booth:
At Booth 4A100, YITAI will demonstrate our latest precision machinery designed to optimize production processes and deliver superior results. Our product lineup includes:
- Die Board Laser Cutting Machine – high-speed, ultra-precise cutting for complex die boards
- Rubber Cutting Machine – efficient and accurate cutting of rubber ejection materials
- Pertinax Milling Machine – robust milling solutions for synthetic materials like Pertinax
Our team of experts will be on hand to provide live demonstrations, answer your questions, and discuss how YITAI’s technology can help you achieve higher efficiency, quality, and cost savings.
Why Visit YITAI?
- Gain insights into the latest advancements in carton manufacturing
- See our machines in action and compare their performance
- Network with industry peers and explore collaboration opportunities
- Receive personalized advice tailored to your production needs
Contact Us:
To schedule a meeting or request more information, please contact us via WhatsApp: +86 15806261086
We look forward to welcoming you at Booth 4A100 in Shenzhen!
Stay connected with us for more updates as the exhibition approaches.
YITAI Precision Machinery – Innovating for Your Success.
