YITAI Precision Machinery is pleased to announce our participation in WEPSEA 2026 (World Expo of Packaging Industry – Southeast Asia), taking place August 27–29, 2026 at the Jakarta International Convention and Exhibition Center, Indonesia. Visit us at Booth No. A2C155.
Bringing Die-Free Packaging Solutions to Southeast Asia
As Southeast Asia’s packaging industry continues to grow, converters, box makers, and foam processors are under increasing pressure to shorten sampling cycles and reduce costs — without compromising on precision. At WEPSEA 2026, YITAI will be presenting our Die-Free Packaging Solution, designed specifically to address this challenge.
Instead of waiting on traditional die-making — a process that can take days and add significant tooling cost to every new design — our solution allows converters to move directly from digital design file to finished sample, across a wide range of materials:
- Corrugated Board
- Grey Board
- PVC & EVA
- Color Box Board
- Honeycomb Board
- Foam
Whether you’re producing packaging samples for a new client pitch, prototyping a color box structure, or processing foam inserts for protective packaging, our solution is built to help you go from concept to sample faster, with fewer tooling costs standing in the way.
What You Can Expect at Our Booth
We understand that choosing the right cutting solution for your production line depends on your specific materials and process requirements. That’s why our team will be on-site throughout WEPSEA 2026 to offer:
🎁 Free Online Demo Cutting — available upon request, so you can see how your own materials perform before making a decision
🤝 1-on-1 Solution Consulting — our team will work with you directly to match the right process and configuration to your production needs, whether you’re a converter exploring digital cutting for the first time or looking to upgrade an existing sampling workflow
Visit Us in Jakarta
We invite packaging converters, box makers, foam processors, and industry partners across Southeast Asia to stop by our booth to learn more about our Die-Free Packaging Solution and discuss how it can fit into your production line.
📍 WEPSEA 2026 🗓️ August 27–29, 2026 📌 Jakarta International Convention and Exhibition Center, Indonesia 🏢 Booth No.: A2C155
Prefer to plan ahead? Reach out to our team in advance to book your free demo slot and make the most of your time at the show.
Halo Jakarta! Sampai jumpa di booth kami!
